Wencon release agent – 30 gram

18.20 excl. VAT

Applied to any surface where epoxy application is not required to adhere. Use on moulds and formers to allow easy release.

SKU: B0986847EN Categories: ,

Product Description

Wencon Release Agent is used in applications where you want to prevent adhesion between Wencon and the substrate.
The release agent is applied in a thin layer and left for drying in ten minutes.
Remove excess material using a cloth.